Huafa Group plans to issue the 2026 Second Short-Term Financing Bond with a scale of 1 billion yuan

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Guandian.com News: On February 25, Zhuhai Huafa Group Co., Ltd. disclosed the offering memorandum for the 2026 Second Phase Ultra-Short-Term Financing Bonds.

According to the announcement, the issuance size is 1 billion RMB, with a term of 270 days. It uses simple interest calculated annually, without compounding, and no additional interest for overdue payments. The coupon rate is determined through negotiations between the issuer and the bookrunner based on the book-building process. The issuance date is set for February 26, 2026. The interest start date, payment date, and debt registration date are all February 27, 2026. The listing and trading date is February 28, 2026. The interest payment and redemption date are scheduled for November 24, 2026.

Dongguan Bank Co., Ltd. serves as the lead underwriter and bookrunner, Beijing Bank Co., Ltd. acts as the joint lead underwriter, and the China Central Depository & Clearing Co., Ltd. is responsible for registration and custody.

Disclaimer: The content and data of this article are compiled by Guandian.com based on publicly available information and do not constitute investment advice. Please verify before use.

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