On October 23, Jin10 reported that Xingchen Technology stated during a specific target research that the company has achieved large-scale implementation of mid-to-high-end chips in its main business. Several high-end products aimed at emerging fields such as intelligent robots, automotive lidar, and edge computing have also seen preliminary research and development results, which will be concentrated and released in the coming years. The shipment proportion of mid-to-high-end chips will further increase, and the gross profit margin is expected to improve with changes in product structure. To cope with the rising prices of storage chips, the company will adjust the prices of some products in the fourth quarter. The SPAD-SoC suitable for automotive main lidar has already had engineering samples, and customer verification and vehicle testing are being carried out in succession, with mass production expected to begin next year. In addition, the chips suitable for automotive and robotic blind spot radar are expected to be produced next year.
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