Gate News message, April 27 — Samsung Electro-Mechanics shares jumped 93.37%, significantly outpacing South Korea’s Kospi benchmark index (up 28.17%) and the electronics sub-index (up 31.42%), as investors bet on AI infrastructure demand for its FC-BGA substrates and multilayer ceramic capacitors (MLCCs).
The company manufactures flip-chip ball grid array (FC-BGA) packaging boards that connect AI chips to mainboards and MLCCs that stabilize power delivery. Both components face severe supply constraints as Nvidia, Google, Amazon, Apple, and Broadcom scale AI infrastructure. Samsung Electro-Mechanics reported that FC-BGA demand exceeded current capacity by more than 50%. The company is investing approximately US$1.2 billion at its Vietnam plant to expand AI-related FC-BGA production, while also preparing a third facility in the Philippines to increase MLCC output. Competitors Ibiden, Shinko Electric, and Unimicron currently control over 70% of the FC-BGA market.
Samsung Electro-Mechanics recently secured an Nvidia deal for FC-BGA used in the Grok3 Language Processing Unit (LPU) chip, with mass production expected in the second quarter. The company is adding customers including Broadcom, Google, Amazon, and Apple, which are developing application-specific integrated circuits (ASICs). Rising component scarcity has already driven up MLCC prices from major producers, increasing overall AI infrastructure costs. Analysts expect supply shortages to persist throughout 2026.
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