FIO
@FIO Protocol
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High-performance Layer1 blockchain關於 FIO
成立時間2018
社群
LinkedIn
Telegram
Twitter
Website
GitHub
標簽
Infra
Layer1
熱度值變化趨勢
團隊成員
George Chu
Founder & CEO
Wen kai Chen
CTO
Abraham Li
Chief Operating Officer
投資方
投融資詳情
Series A(2019-09-04)
金額：$1.82億
投資方：YZi LabsNGC VenturesLuneX VenturesBlockwall
估值：--